Sugimoto, Yuka;Suzuki, Yasuhito;Matsumoto, Akikazu published 《Evaluation of heat resistance of metal-resin bonding using epoxy monoliths prepared with various epoxy resins and diamine curing agents》. The research results were published in《Nippon Setchaku Gakkaishi》 in 2020.Recommanded Product: 2657-87-6 The article conveys some information:
Epoxy monoliths with a co-continuous porous structure were produced by a thermosetting reaction using combinations oi 4 kinds of epoxy resins, 9 kinds of diamine curing agents, and 2 kinds porogens (pore forming agents), and applied to dissimilar materials bonding between metals and engineering plastics. An epoxy monolith was prepared on a stainless or copper plate, and a polycarbonate or poly (phenylene sulfide) plate was thermally welded to prepare a bonding test piece. The heat resistance of the epoxy monolith bonding systems used in this study was evaluated from the results of the tensile shear test before and after heat treatment. In addition, the thermogravimetric anal. of the monolith materials revealed the thermal decomposition behavior of the cured epoxy. Based on these results, the effects of the structure and the number of functional groups of the epoxy resins and the diamine curing agents on the porous structure bonding strength, and heat resistance of the epoxy monoliths were discussed. To complete the study, the researchers used 3-(4-Aminophenoxy)aniline (cas: 2657-87-6) .
3-(4-Aminophenoxy)aniline is one of ethers-buliding-blocks. Ethers feature bent C–O–C linkages. In dimethyl ether, the bond angle is 111° and C–O distances are 141 pm. The barrier to rotation about the C–O bonds is low. Recommanded Product: 2657-87-6 The bonding of oxygen in ethers, alcohols, and water is similar. In the language of valence bond theory, the hybridization at oxygen is sp3.
Reference:
Ether – Wikipedia,
Ether | (C2H5)2O – PubChem