Wang, Kai;Yuan, Xiaojie;Zhan, Maosheng published 《Comparison between microwave and thermal curing of a polyimide adhesive end-capped with phenylethynyl groups》 in 2017. The article was appeared in 《International Journal of Adhesion and Adhesives》. They have made some progress in their research.COA of Formula: C12H12N2O The article mentions the following:
Microwave energy was investigated to cure phenylethynyl-end-capped polyimide adhesive using an industrial microwave oven at a frequency of 2.45 GHz and the adhesive properties, thermal performance and curing mechanism for bonding stainless steel were evaluated. The results are compared with those of thermal cured samples. It was demonstrated that while the lap shear strength properties and thermal performance of microwave cured samples were almost as good as those cured via a thermal process, the microwave curing process resulted in a significant reduction in the process cycle time and power consumption. The Fourier transform IR (FTIR) spectroscopy and XPS anal. of the cured resin structures suggested that there was no obvious difference in the chem. reactions taking place during the microwave and the thermal cure processes.3-(4-Aminophenoxy)aniline (cas: 2657-87-6) were involved in the experimental procedure.
3-(4-Aminophenoxy)aniline is one of ethers-buliding-blocks. Ethers lack the hydroxyl groups of alcohols. Without the strongly polarized O―H bond, ether molecules cannot engage in hydrogen bonding with each other. COA of Formula: C12H12N2OEthers do have nonbonding electron pairs on their oxygen atoms, however, and they can form hydrogen bonds with other molecules (alcohols, amines, etc.) that have O―H or N―H bonds.
Reference:
Ether – Wikipedia,
Ether | (C2H5)2O – PubChem